The Alpenföhn "snow cannon" is a high-end thermal compound based on silicone.

A safe citrus base solvent which leaves no residue. Ideal for cleaning CPU, GPU, Northbridge, RAM etc

Akasa double-sided thermal adhesive tape is a highly effective thermal interface designed for bonding heatsinks to chipsets or other components requiring strong fixing in a hot environment.

TIM Clean fluid removes all thermal pads and silver based thermal grease from the base of heatsinks and CPU surface. TIM Clean is a citrus based solvent and is safe to use.

AK-455 is a new improved formulated thermal compound that gives high performance heat transfer between the CPU and heatsink.

An evolution in silicone technology delivers outstanding thermal performance.Pro-grade Silicone technology provides a stable thermal compounnd.

The Akasa AK-TC5022 high performance thermal compound is a newly developed silicone paste which ensures a consistent and reliable thermal performance.

Arctic Alumina Thermal Adhesive is a two part permanent adhesive for thermal joints in minimum bond line applications. It is NOT intended to be used between a CPU and the CPU heatsink.

Introducing Arctic Alumina Thermal Compound. The first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions.

Introducing Arctic Alumina Thermal Compound. The first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions.

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.

Arctic Silver Thermal Adhesive is a two part permanent adhesive for thermal joints in minimum bond line applications. It is NOT intended to be used between a CPU and the CPU heatsink.

Arctic Silver 5 uses three unique shapes and sizes of 99.9% pure silver particles to maximize particle-to-particle contact area and thermal transfer.

Arctic Silver 5 uses three unique shapes and sizes of 99.9% pure silver particles to maximize particle-to-particle contact area and thermal transfer.

ArctiClean 1 Thermal Material Remover quickly emulsifies and dissolves the existing thermal grease or pad from the CPU. ArctiClean 2 Thermal Surface Purifier removes the remaining residue.

Turbo MX-2 is a high conductive and low resistance compound for components that require the best thermal dissipation.

Turbo MX-2 is a high conductive and low resistance compound for components that require the best thermal dissipation.

Turbo MX-2 is a high conductive and low resistance compound for components that require the best thermal dissipation.

Turbo MX-2 is a high conductive and low resistance compound for components that require the best thermal dissipation.

With its competitive pricing, the performance of the ARCTIC MX-4 is the best thermal paste on the market by far.

With its competitive pricing, the performance of the ARCTIC MX-4 is the best thermal paste on the market by far.

The IC Essential E1 is a high performance thermal compound to meet the requirements of mainstream CPU cooling.

The IC Value V1 is a high performance thermal compound with high thermal conductivity and low thermal resistance.

The Coollaboratory Liquid Cleaning Set enables a fast, simple and effective removal of impurities and residues of heat conduction pastes from metallic contact surfaces in PC-systems.

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The Liquid Ultra is made of 100% metal, but it has an absolute new usability and offers an outstanding performance.

Coollaboratory Liquid Pro is the first heat conducting medium, which is worthy of its name.

This "try-out bundle" has a halved content. Convince yourself of the superior performance of these thermal paste!

The HTX-EE provides a solid performance and it comes in a 3.5 gram tube.

The EK-TIM Indigo Xtreme is a thermal spacer (EIT), to sit right between a CPU and a water-block (or heatsink) is used to keep the processor cool.

The EK-TIM Indigo Xtreme is a thermal spacer (EIT), to sit right between a CPU and a water-block (or heatsink) is used to keep the processor cool.

The EK-TIM Indigo Xtreme is a thermal spacer (EIT), to sit right between a CPU and a water-block (or heatsink) is used to keep the processor cool.

The EK-TIM Indigo Xtreme is a thermal spacer (EIT), to sit right between a CPU and a water-block (or heatsink) is used to keep the processor cool.

Based on Independent tests IC Diamond performs 2.77°C better than OCZ Freeze, 3.28°C better than Arctic Cooling MX-3, 3.38°C better than Arctic Silver 5 and 4.74°C better than the Intel generic paste.

Based on Independent tests IC Diamond performs 2.77°C better than OCZ Freeze, 3.28°C better than Arctic Cooling MX-3, 3.38°C better than Arctic Silver 5 and 4.74°C better than the Intel generic paste.

The markets most advanced Thermal Interface material.

The markets most advanced Thermal Interface material.

The markets most advanced Thermal Interface material.

Noctua's NT-H1 is a pro-grade TIM solution for enthusiasts who demand both exceptional performance and maximum ease of use

The Prolimatech PK-1 Nano Aluminium Thermal Compound is thermal compound that is at the head of the pack as far as performance, and is very easy to apply.

The Prolimatech PK-1 Nano Aluminium Thermal Compound is thermal compound that is at the head of the pack as far as performance, and is very easy to apply.