AK-455 is a new improved formulated thermal compound that gives high performance heat transfer between the CPU and heatsink.

An evolution in silicone technology delivers outstanding thermal performance.Pro-grade Silicone technology provides a stable thermal compounnd.

TIM Clean fluid removes all thermal pads and silver based thermal grease from the base of heatsinks and CPU surface. TIM Clean is a citrus based solvent and is safe to use.

The Akasa AK-TC5022 high performance thermal compound is a newly developed silicone paste which ensures a consistent and reliable thermal performance.

Akasa double-sided thermal adhesive tape is a highly effective thermal interface designed for bonding heatsinks to chipsets or other components requiring strong fixing in a hot environment.

A safe citrus base solvent which leaves no residue. Ideal for cleaning CPU, GPU, Northbridge, RAM etc

The Alpenföhn "snow cannon" is a high-end thermal compound based on silicone.

Turbo MX-2 is a high conductive and low resistance compound for components that require the best thermal dissipation.

Turbo MX-2 is a high conductive and low resistance compound for components that require the best thermal dissipation.

Turbo MX-2 is a high conductive and low resistance compound for components that require the best thermal dissipation.

Turbo MX-2 is a high conductive and low resistance compound for components that require the best thermal dissipation.

With its competitive pricing, the performance of the ARCTIC MX-4 is the best thermal paste on the market by far.

With its competitive pricing, the performance of the ARCTIC MX-4 is the best thermal paste on the market by far.

Arctic Silver 5 uses three unique shapes and sizes of 99.9% pure silver particles to maximize particle-to-particle contact area and thermal transfer.

Arctic Alumina Thermal Adhesive is a two part permanent adhesive for thermal joints in minimum bond line applications. It is NOT intended to be used between a CPU and the CPU heatsink.

Introducing Arctic Alumina Thermal Compound. The first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions.

Introducing Arctic Alumina Thermal Compound. The first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions.

ArctiClean 1 Thermal Material Remover quickly emulsifies and dissolves the existing thermal grease or pad from the CPU. ArctiClean 2 Thermal Surface Purifier removes the remaining residue.

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.

Arctic Silver Thermal Adhesive is a two part permanent adhesive for thermal joints in minimum bond line applications. It is NOT intended to be used between a CPU and the CPU heatsink.

The IC Essential E1 is a high performance thermal compound to meet the requirements of mainstream CPU cooling.

The IC Value V1 is a high performance thermal compound with high thermal conductivity and low thermal resistance.

The Coollaboratory Liquid Cleaning Set enables a fast, simple and effective removal of impurities and residues of heat conduction pastes from metallic contact surfaces in PC-systems.

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!

This "try-out bundle" has a halved content. Convince yourself of the superior performance of these thermal paste!

Coollaboratory Liquid Pro is the first heat conducting medium, which is worthy of its name.

The Liquid Ultra is made of 100% metal, but it has an absolute new usability and offers an outstanding performance.

The HTX-EE provides a solid performance and it comes in a 3.5 gram tube.

The EK-TIM Indigo Xtreme is a thermal spacer (EIT), to sit right between a CPU and a water-block (or heatsink) is used to keep the processor cool.

The EK-TIM Indigo Xtreme is a thermal spacer (EIT), to sit right between a CPU and a water-block (or heatsink) is used to keep the processor cool.

The EK-TIM Indigo Xtreme is a thermal spacer (EIT), to sit right between a CPU and a water-block (or heatsink) is used to keep the processor cool.

The EK-TIM Indigo Xtreme is a thermal spacer (EIT), to sit right between a CPU and a water-block (or heatsink) is used to keep the processor cool.

Based on Independent tests IC Diamond performs 2.77°C better than OCZ Freeze, 3.28°C better than Arctic Cooling MX-3, 3.38°C better than Arctic Silver 5 and 4.74°C better than the Intel generic paste.

Based on Independent tests IC Diamond performs 2.77°C better than OCZ Freeze, 3.28°C better than Arctic Cooling MX-3, 3.38°C better than Arctic Silver 5 and 4.74°C better than the Intel generic paste.

The markets most advanced Thermal Interface material.

The markets most advanced Thermal Interface material.

The markets most advanced Thermal Interface material.

Noctua's NT-H1 is a pro-grade TIM solution for enthusiasts who demand both exceptional performance and maximum ease of use

The Prolimatech PK-1 Nano Aluminium Thermal Compound is thermal compound that is at the head of the pack as far as performance, and is very easy to apply.

The Prolimatech PK-1 Nano Aluminium Thermal Compound is thermal compound that is at the head of the pack as far as performance, and is very easy to apply.