Stock Code: TH-002-AC
Manufacturers Code: ASC-2.7G
The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.
10+ in stock for immediate despatch
Like the original Céramique, Céramique 2 uses only ceramic fillers so it is neither electrically conductive nor capacitive. The tri-linear composite of aluminum oxide, zinc oxide and boron nitride allows the thinnest possible bond line with modern processors, heatsinks and electronics. Critically-sized particles and new ultra-high shear mixing techniques maximize Céramique 2's thermal performance and help maintain a stable homogenous suspension. This exclusive combination provides performance exceeding most metal based compounds.
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