Antec
Formula 6 Nano Diamond Thermal Compound

  • Antec’s Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink
 
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Stock Code: TH-000-AN

EAN: 0761345770606

MPN: 0-761345-77060-6

Manufacturer: Antec

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Product information:

Formula 6 Nano Diamond Thermal Compound

Antec’s Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6’s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec’s Formula 6 for a diamond-caliber solution.


Diamond particles measuring 0.0000015 cm rated at 5.3 w/mK
Extended -30°C to 250°C stable temperature range ideal for performance cooling
Lighter, easier to spread stable composition won?t crack or dry out
Quantity: 4 g
Specific gravity: 2.2 g/cm3
 

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Great results

I have been using this stuff for the last 2 years, it comes with a spreader, I have tried both application methods (small dot and also spreading out)
I found that actually spreading this compound produces better results but only by around 1 degree at idle and about 2 degrees under 100% load.
It is certainly noticeable though, the compound itself is rather viscous and can be a bit of a pain to spread evenly the first time you use it, I would say you probably use about 5% more compound using the spreading method as opposed to the small dot method.
Good product for the price, I have had a tube for over 2 years now and have used it at least 6 times and still have about half left.

2014-07-13
 

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