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**B Grade** Skylake-X Direct Die Frame
B Grade items may have been used, have damaged packaging, missing accessories or a combination of these (Motherboards may be missing I/O shields).
Some items may have scuff marks or slight scratches but should otherwise be an operable product.
The der8auer Skylake-X Direct Die Frame:
- Allows the CPU to be operated and cooled without a heatspreader
- Secure mounting for maximum cooling performance
- Compatible with current Socket 2066 motherboards
- Manufactured in high-grade black anodized aluminium
Taking Overclocking to the LimitThe nickel-plated copper heat spreader, in the factory default setup, removes the heat produced by the CPU and transfers it into the CPU cooler which dissipates the thermal energy across a larger surface area than that available to the silicon alone. However the role of forming a tight seal between said components falls to a Thermal Interface Material (TIM) located between the heat spreader and the silicon chip. This standard thermal paste supplied with Intel processors offers relatively low levels of thermal conductivity, as a result of this it frequently struggles to maintain reasonable temperatures when faced with heavy overclocking.
In this scenario the effectiveness of the CPU cooler is irrelevant due to the fact that heat build-up is taking place within the interior of the processor package itself. For a CPU to receive adequate cooling, even when being pushed to its limits via overclocking, enthusiasts swiftly remove the heat spreader with the help of the der8auer Delid Die Mate X, replacing the thermal paste with liquid metal and subsequently remounting the heat spreader. This results in a typical 10-20°C reduction in the temperatures of Intel Skylake-X processors. The Skylake-X Direct Die Frame removes the need for two further layers consisting of the heat spreader and thermal paste, allowing temperatures to fall by a further 2-8°C. This results in a marked improvement in overclocking performance.
The outer edge of the der8auer Skylake-X Direct Die Frame is located a mere 0,1 mm below the silicon chip itself, effectively protecting against damage. Furthermore, the black anodized coating isolates the aluminium of the Direct Die Frame as it is no longer electrically conductive. As a result the SK-X DDF can be seated safely and securely against the contact area of the CPU. Installation of the SK-X DDF requires that the Intel socket retention module first be removed, this then allows the included back plate to be attached to the reverse of the motherboard with adhesive pads, the CPU inserted, and the frame secured by means of four screws. The SK-X DDF is manufactured according to extremely tight tolerances to ensure an equal distribution of downward force. This helps to maintain optimum contact between the motherboard and CPU while ensuring all devices, such as PCIe cards or RAM modules, are recognized correctly.
*** Important Warning! ***
Removal of the CPU's heatspreader is performed at your own risk and results in the invalidation of the manufacturer's guarantee and warranty!
Note on Compatibility: The removal of the integrated heat spreader results in a small reduction in the mounting height of the CPU cooler. Consequently those coolers with fixed mounting heights are not able to be mounted. For this reason please confirm prior to installation whether the cooler you plan to use is capable of being set to a lower mounting height. Compatibility with watercoolers from EKWB, Aquacomputer, as well as AiO watercoolers from Corsair and NZXT are guaranteed to fit.
- Type: CPU mounting frame
- Material: Anodized aluminium
- Colour: Black
- Compatible with all Socket 2066 motherboards
- Compatible with all Intel Skylake-X processors
1x Direct Die Frame
1x Back plate
5x M3 screws
1x Hex key
1x Torx key
1x Plastic spatula