replace h-50 thermal paste?

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just read about p55 boards and the foxconn socket, only recently put my h-50 onto my asus p7p55d le mobo and i know that i saw foxconn on the underside of my mobo while i was attaching the back plate.
i will have to remove my h50 to see what socket i have and was wondering how much arctic silver 5 to put on cpu after i check out the socket.
i have read that the method has to be slightly different due to the way the cooling plate is pushed and twisted into place.
is arctic silver 5 even a good thing to use with h-50?
read so many different posts on the web, still none the wiser tbh

any help would be great, thanks
 
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Twisting the block doesn't negatively effect performance pretty much regardless of method used. It actually helps to remove air bubbles.

Just apply a pea-sized dot in the middle and squeeze it out. If you look around the first page you'll find a youtube video that shows different thermal paste applying methods when compared under a glass plate.
 
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so, in other words, same method as always, pea in middle or thin line as instructed by arctic silver 5 pdf instructions. thats good to know.
hope i havent got the dodgy foxconn socket on my mobo, only had it since early january (ordered frrom OC on 5th)
might not have installed h-50 properly first time around anyway, took at least 3-4 attempts to lock in cooler, i could see some of the paste was on the cpu when i finally locked it in place.
as i understand it, silver 5 can take uptp 200 hours to reach maximum efficiency, probably not a good idea to overclock my i5 when i apply it to cpu straight away then.

silver 3 was used in that video, is it better or worse than silver 5?

is mx-3 gonna be better than silver 5 for h-50 or is the difference marginal?
 
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