Hmm, ok, thanks. Thats strange though because I havent even messed with that.
Its a Sapphire 1900xt.
I suppose I better go driver hunting. See if we can fix that.
I tried that (I have the same memory as him by the looks of it) and it wouldnt boot.
This would though:
Left CAS latency as auto then Trcd 5, Trp 5, Tras 12.
http://valid.x86-secret.com/show_oc?id=108607
I have pretty much identical settings to you.
http://valid.x86-secret.com/show_oc?id=108600
But in the 3DMark06 HDR/SM3.0 Graphic tests (ie. Canyon Flight and Deep Freeze) Im getting a lot of artifacts, mostly in the latter test. Fancy trying it to see if youre getting the same problem? :p
E6300/DS3/Scythe Ninja
Stock idle: 38
@2.94GHz idle: 40
After several hours of oblivion: 42
It strikes me as odd that theres only a 2 degree rise after that. Not that Im complaining. Might have to try and overclock it a little bit more tomorrow.
Ive left the voltages on default for now (Whatever that may be, I cant see anything that tells me).
Anyway, it seems to have made it past it now... which is odd because I havent actually changed anything. I just reset everything to default and started again. Its now running at 370. *shrugs*
Problem overclocking 6300 with corsair memory
Im using the DS3 board (F3 bios) and Corsair TWIN2X2048-6400 XMS2 CL5 memory.
I cant get it to boot at more than 310 with memory at 1:1.
Any ideas? Or is that memory just crap?
Thanks. Ill look into getting a cable. But for now Ive done what a couple of you suggested and just put the PSU outside the case.
Everything seems to be running nicely. Once I do a few more tests Ill start playing. :D
How? If I try and stretch it any more its going to snap. o.O
Im going to head in to town tomorrow and find out.
Maybe. If the heatsink was smaller though it would have fit. Similarly, if the power supply fitted in at the top it would have fit. Its just the mixture of the two that makes...
Looking at the arctic silver website it looks as if for CPUs with the large heat spreaders (ie. Conroe) you just put a small blob of paste in the middle and shove the heatsink on it.
Is that right? Is it the best way to do it?
Just doesnt seem like it would spread it very well.
I bought the DS3. A benchmark by somebody on the xtremesystems forums suggest its about the same as the p5w in terms of performance/overclocking.
And if the 6300 overclocks that well with the stock heatsink then using a better one should easily get it on par with the 6700.
I was planning to get the E6600 but due to the delays and the impressive overclocking results of the E6300 Im now thinking of getting the OEM 6300 from here.
If I do then the only other thing I need is a heatsink/fan correct? Therell still be thermal paste on the CPU right?
Also, any...
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