Soldato
I expect a die shrink and a slight re-jig of the architecture... a bit like how the 8800GTS 512mb G92 ended up 15% faster on the clocks on an GTS250 all because of shrinks and re-thinks that came with it.
There certainly won't be a die shrink (assuming you mean a reduction in the manufacturing process?). The chips will be manufactured on 40nm, as that is all that is available right now from TSMC. The reduction to 32nm at TSMC was cancelled in favour of a 28nm process which will come into play next year.