Associate
- Joined
- 19 Jun 2017
- Posts
- 1,029
Just a back of the envelope analysis regarding the pricing of RX6900..
Following are the assumptions:
Die size: 505 mm^2
Wafer size: 70.686 mm^2 (300 mm dia)
Potential die count: 140
Partial dies/no dies at corners: 30%
Available dies: 98 (edit: rounded upto 100)
Defective (lasered) dies: 25%
Expected output per wafer:
Full dies: 75
Lasered dies: 25
per wafer costs approx $10.000 to AMD (read it somewhere in the forum)
add an additional 10% for processing so $11.000
AMD will probably sell full dies at 25% premium to lasered dies while ensuring a gross margin of 50%
75*1.25p+25*p = $22.000
So the cost "p" per lasered die for AIBs will be approx. $185
and the cost per full die will be approx. $230
Now AIBs will target 40% gross margin.. so just the price of the die in BOM is approx. $385
There will be approx 10% of logistics cost on that .. so by the time it reaches distributors the top die would cost $425
Now distributors and retailers will like to make approx 20% commissions on the sale price.. so the suggested price just for the top die would be $530
This is just for the die.. havent factored costs related to PCB/heatsink, etc.
Then there will be taxes over and above that.
Can someone check this.. i have been probably generous with margins