8Pack Edition Team Group Dark Pro & Xtreem Memory Kits - An Overclocker's Dream

The new "8Pack Edition" Dark Pro- and Xtreem series from Team Group in cooperation with famous overclocking champion Ian "8Pack" Parry and the graphics card expert Andrew "Gibbo" Gibson represent the cutting edge in high-end memory kits. These memory modules, produced in conjunction with Caseking and Overclockers UK, have been manufactured to the highest standards in terms of quality, performance and compatibility and in the UK are available for purchase exclusively at the Overclockers UK shop.

Premium Overclocked RAM - Selected & Produced According to 8Pack's Strict Criteria

The modules exclusively use selected Samsung B-die chips that have been tested by the 8Pack team for their compatibility and overclocking potential. With aggressive latencies out of the box and their high overclocking potential they have been designed from the ground up for demanding gamers and overclockers. Those of us determined to get the best possible performance from their systems, especially in light of the frequency-sensitive nature of the Kaby Lake and Ryzen platforms, will be particularly keen to get their hands on these modules.

Team Group Dark Pro 8Pack Edition Memory Kits

8Pack Dark Pro

The Features of the "8Pack Edition" Team Group Dark Pro Kits:

  • Selected and produced according to the highest 8Pack performance and quality standards
  • Tested and compatible with the newest Intel Kaby Lake and AMD Ryzen platforms
  • Selected Samsung B-dies for maximum compatibility and stability
  • Sandwich-style construction for improved compatibility
  • High OC potential of over 4.000 MHz or underclocking for CAS10 timings possible

 

Team Group T-Force Xtreem 8Pack Signature Edition Memory Kits

8Pack Xtreem

The Features of the "8Pack Edition" Team Group Xtreem Kits:

  • Selected and produced according to the highest 8Pack performance and quality standards
  • Dual- and Quad Channel-Kits tested with Intel Kaby Lake and AMD Threadripper
  • Selected Samsung B-dies for maximum compatibility and stability
  • High OC potential of over 4.500 MHz or underclocking for CAS10 timings possible
  • Efficient extruded aluminium heat spreader design



>>> To the 8Pack Memory Kits in the OcUK Shop <<<

Massive Overclocking Potential and Ultra Low Timings

The overclocking potential extends to Intel's new X299 platform at above 4.000 MHz and at up to 3.600 MHz on AMD's Ryzen chipsets with moderate latencies. These RAM kits also retain their exceptional flexibility when it comes to latency tuning. This is what allows reducing memory frequencies to handle CAS10 timings flawlessly. The modules have been kitted out with massive anodised aluminium heatspreaders that lend them a sleek yet very premium aesthetic. They also enable the efficient transfer of heat away from the dies while ensuring that a more than adequate cooling capacity remains available while overclocking.

 
 
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