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The Intel 12th Gen CPU Contact Frame is an assembly aid that replaces the original Integrated Loading Mechanism (ILM) of the mainboard to enable better cooling performance of CPU coolers through optimized contact pressure.
Due to the changed dimensions of the Intel Alder Lake processors (Intel Core 12th Gen.) for the Intel socket LGA1700 compared to the socket 1200 processors (and older generations, such as socket LGA115X) and the associated changes to the dimensions of the socket, new mounting brackets for CPU coolers have become necessary.
In addition, the standard ILM only has contact points in the middle of the elongated CPU. Due to the resulting uneven contact pressure of the processor in the socket, the surface of the Integrated Heatspreader (IHS) curves concavely, whereby the base plate of the CPU cooler primarily rests on the edges of the IHS and thus the thermal "hotspot" in the middle of the CPU is not covered.
The Intel 12th Gen CPU Contact Frame replaces the mainboard's ILM. A special inner contour, which transfers the contact pressure from the center to the edges during assembly, prevents the CPU from concaving. This increases the potential contact area with the CPU cooler and the "hotspot" in particular can be better covered.
Warning: Removing the CPU heat spreader and the mainboard socket holder (retention module) is done at your own risk and is always accompanied by the complete loss of the manufacturer's guarantee and warranty !
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