The Full Body Copper Heatsink takes into account the heat transfer from key components on both the front and back of the device, the controller and NAND Flash. Full copper heatsinks have 69% higher thermal Conductivity compared to aluminum heatsinks, provide the best heat dissipation for read/write performance.
Compared with a plated M.2 heat spreader, new efficient copper heat spreaders with 27 fins add more surface area which improve thermal transfer from heating sources to obtain thermal balance sooner. Make sure key components of PCIe 4.0 SSD to keep suitable working temperature under ultra high transfer rate.
M.2 2280 is a small form factor that is perfect fit to all kinds of PC upgrades. M.2 slots are becoming more popular on motherboards these days. You can easily install the SSD to enjoy faster response.
To provide the best performance of AORUS NVMe Gen4 SSD, AORUS X570 MBs with the low-impedance server
-level circuit board design and the PCIe 4.0 over clocking controller, make the PCIe bandwidth is further increased, let the transmission speed once again breaks the limit.
To get these performance levels you will require a Gen4 motherboard such as those using AMD's latest X570 chipset!